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MCP1703
250 mA, 16V, Low Quiescent Current LDO Regulator
Features
* * * * * * * 2.0 A Typical Quiescent Current Input Operating Voltage Range: 2.7V to16.0V 250 mA Output Current for Output Voltages 2.5V 200 mA Output Current for Output Voltages < 2.5V Low Drop Out Voltage, 625 mV typical @ 250 mA for VR = 2.8V 0.4% Typical Output Voltage Tolerance Standard Output Voltage Options: - 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V Output voltage range: 1.2V to 5.5V in 0.1V increments (50 mV increments available upon request) Stable with 1.0 F to 22 F ceramic output capacitance Short-Circuit Protection Overtemperature Protection
Description
The MCP1703 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 A of quiescent current (typical). The input operating range is specified from 2.7V to 16.0V, making it an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cell Li-Ion-powered applications. The MCP1703 is capable of delivering 250 mA with only 625 mV (typical) of input to output voltage differential (VOUT = 2.8V). The output voltage tolerance of the MCP1703 is typically 0.4% at +25C and 3% maximum over the operating junction temperature range of -40C to +125C. Line regulation is 0.1% typical at +25C. Output voltages available for the MCP1703 range from 1.2V to 5.5V. The LDO output is stable when using only 1 F of output capacitance. Ceramic, tantalum, or aluminum electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application. Package options include the SOT-223-3, SOT-23A, 2x3 DFN-8, and SOT-89-3.
*
* * *
Applications
* * * * * * * * * * * * * Battery-powered Devices Battery-powered Alarm Circuits Smoke Detectors CO2 Detectors Pagers and Cellular Phones Smart Battery Packs Low Quiescent Current Voltage Reference PDAs Digital Cameras Microcontroller Power Solar-Powered Instruments Consumer Products Battery Powered Data Loggers
Package Types
2x3 DFN-8 *
VOUT 1 NC 2 NC 3 GND 4 EP 9 8 VIN 7 NC 6 NC 5 NC 1 2 GND VOUT
3-Pin SOT-23A
VIN 3
3-Pin SOT-89
SOT-223-3
Related Literature
* AN765, "Using Microchip's Micropower LDOs", DS00765, Microchip Technology Inc., 2002 * AN766, "Pin-Compatible CMOS Upgrades to BiPolar LDOs", DS00766, Microchip Technology Inc., 2002 * AN792, "A Method to Determine How Much Power a SOT23 Can Dissipate in an Application", DS00792, Microchip Technology Inc., 2001
VIN
1
2
3
1 VIN
2
3
GND VIN VOUT
GND VOUT
* Includes Exposed Thermal Pad (EP); see Table 3-1.
(c) 2009 Microchip Technology Inc.
DS22049D-page 1
MCP1703
Functional Block Diagrams
MCP1703
VIN VOUT
Error Amplifier +VIN Voltage Reference +
Overcurrent Overtemperature
GND
Typical Application Circuits
MCP1703
VOUT
VIN
VOUT 3.3V COUT 1 F Ceramic IOUT 50 mA
VIN
VIN
9V Battery
+
CIN 1 F Ceramic
GND
DS22049D-page 2
(c) 2009 Microchip Technology Inc.
MCP1703
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD..................................................................................+18V All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V) Peak Output Current ...................................................500 mA Storage temperature .....................................-65C to +150C Maximum Junction Temperature ................................. +150C ESD protection on all pins (HBM;MM)............... 4 kV; 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C. Boldface type applies for junction temperatures, TJ (Note 7) of -40C to +125C. Parameters Input / Output Characteristics Input Operating Voltage Input Quiescent Current Maximum Output Current VIN Iq IOUT_mA 2.7 -- 250 50 100 150 200 Output Short Circuit Current IOUT_SC -- -- 2.0 -- 100 130 200 250 400 16.0 5 -- -- -- -- -- -- V A mA mA mA mA mA mA Note 1 IL = 0 mA For VR 2.5V For VR < 2.5V, VIN 2.7V For VR < 2.5V, VIN 2.95V For VR < 2.5V, VIN 3.2V For VR < 2.5V, VIN 3.45V VIN = VIN(MIN) (Note 1), VOUT = GND, Current (average current) measured 10 ms after short is applied. Note 2 Note 3 (VOUT(MAX) + VDROPOUT(MAX)) VIN 16V, Note 1 IL = 1.0 mA to 250 mA for VR >= 2.5V IL = 1.0 mA to 200 mA for VR < 2.5V VIN = 3.65V, Note 4 Symbol Min Typ Max Units Conditions
Output Voltage Regulation VOUT Temperature Coefficient Line Regulation Load Regulation
VOUT TCVOUT VOUT/ (VOUTXVIN)
VR-3.0% VR-2.0% -- -0.3 -2.5
VR0.4 % 50 0.1 1.0
VR+3.0% VR+2.0% -- +0.3 +2.5
V ppm/C %/V %
VOUT/VOUT
Note 1: 2: 3: 4: 5: 6:
7:
The minimum VIN must meet two conditions: VIN 2.7V and VIN (VOUT(MAX) + VDROPOUT(MAX)). VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 A. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
(c) 2009 Microchip Technology Inc.
DS22049D-page 3
MCP1703
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C. Boldface type applies for junction temperatures, TJ (Note 7) of -40C to +125C. Parameters Dropout Voltage Note 1, Note 5 Symbol VDROPOUT Min -- -- -- -- -- Output Delay Time Output Noise Power Supply Ripple Rejection Ratio Thermal Shutdown Protection Note 1: 2: 3: 4: 5: 6: TDELAY eN PSRR -- -- -- Typ 330 525 625 750 -- 1000 8 44 -- Max 650 725 975 1100 -- -- Units mV mV mV mV mV s Conditions IL = 250 mA, VR = 5.0V IL = 250 mA, 3.3V VR < 5.0V IL = 250 mA, 2.8V VR < 3.3V IL = 250 mA, 2.5V VR < 2.8V VR < 2.5V, See Maximum Output Current Parameter VIN = 0V to 6V, VOUT = 90% VR, RL = 50 resistive f = 100 Hz, COUT = 1 F, IL = 100 A, VINAC = 100 mV pk-pk, CIN = 0 F, VR = 1.2V
V/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 F dB
TSD
--
150
--
C
7:
The minimum VIN must meet two conditions: VIN 2.7V and VIN (VOUT(MAX) + VDROPOUT(MAX)). VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 A. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS1
Parameters Temperature Ranges Operating Junction Temperature Range Maximum Junction Temperature Storage Temperature Range Thermal Package Resistance (Note 2) Thermal Resistance, 3LD SOT-223 Thermal Resistance, 3LD SOT-23A Thermal Resistance, 3LD SOT-89 Thermal Resistance, 8LD 2x3 DFN Note 1: JA JC JA JC JA JC JA JC -- -- -- -- -- -- -- -- 62 15 336 110 153,3 100 93 26 -- -- -- -- -- -- -- -- C/W C/W C/W C/W EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board TJ TJ TA -40 -- -65 -- -- -- +125 +150 +150 C C C Steady State Transient Sym Min Typ Max Units Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability. Thermal Resistance values are subject to change. Please visit the Microchip Website for the latest packaging information.
2:
DS22049D-page 4
(c) 2009 Microchip Technology Inc.
MCP1703
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
6.00 Quiescent Current (A) 5.00 4.00 3.00 2.00 1.00 0.00 2
0C -45C +25C +90C +130C
VOUT = 1.2V IOUT = 0 A
120 GND Current (A) 100 80 60 40 20 0
VOUT = 1.2V VIN = 2.7V
4
6
8
10
12
14
16
18
0
40
80
120
160
200
Input Voltage (V)
Load Current (mA)
FIGURE 2-1: Voltage.
6.00 Quiescent Current (A) 5.00 4.00 3.00 2.00 1.00 0.00 2 4 6
+90C
Quiescent Current vs. Input
FIGURE 2-4: Current.
120 GND Current (A) 100 80 60 40 20 0
Ground Current vs. Load
VOUT = 2.5V IOUT = 0 A +130C
VOUT = 5.0V VIN = 6.0V
-45C 0C
+25C
VOUT = 2.5V VIN = 3.5V
8
10
12
14
16
18
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-2: Voltage.
6.00 Quiescent Current (A) 5.00 4.00
Quiescent Current vs. Input
FIGURE 2-5: Current.
3.00 Quiescent Current (A) 2.50 2.00 1.50 1.00 0.50 0.00
VOUT = 2.5V VIN = 3.5V
Ground Current vs. Load
VOUT = 5.0V IOUT = 0 A 0C +130C -45C
VOUT = 1.2V VIN = 2.7V
IOUT = 0 mA
3.00
+25C
2.00 1.00 6 8 10 12
+90C
VOUT = 5.0V VIN = 6.0V
14
16
18
-45
-20
5
30
55
80
105
130
Input Voltage (V)
Junction Temperature (C)
FIGURE 2-3: Voltage.
Quiescent Current vs. Input
FIGURE 2-6: Quiescent Current vs. Junction Temperature.
(c) 2009 Microchip Technology Inc.
DS22049D-page 5
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.240 Output Voltage (V) 1.230 1.220 1.210 1.200 1.190 1.180 2 4 6 8 10 12 14 16 18 Input Voltage (V)
+25C +130C +90C
VOUT = 1.2V ILOAD = 0.1 mA
1.24 Output Voltage (V)
-45C
1.23
-45C
0C
+25C
0C
1.22 1.21 1.20 1.19 1.18 0 20 40 60 80 100 120 140 160 180 200 Load Current (mA)
+90C +130C VIN = 3.0V VOUT = 1.2V
FIGURE 2-7: Voltage.
2.58 Output Voltage (V) 2.56 2.54 2.52 2.50 2.48 2.46 2.44 2 4 6
+130C
Output Voltage vs. Input
FIGURE 2-10: Current.
2.54 2.53 Output Voltage (V) 2.52 2.51 2.50 2.49 2.48 2.47 2.46 0
-45C +90C
Output Voltage vs. Load
VOUT = 2.5V ILOAD = 0.1 mA +90C
VIN = 3.5V VOUT = 2.5V +25C
0C +25C
-45C
0C
+130C
8
10
12
14
16
18
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-8: Voltage.
5.16 5.12 Output Voltage (V) 5.08 5.04 5.00 4.96 4.92 4.88 6 8
+130C
Output Voltage vs. Input
FIGURE 2-11: Current.
5.06 5.04 Output Voltage (V) 5.02 5.00 4.98 4.96 4.94 4.92 0
+25C +130C
Output Voltage vs. Load
VOUT = 5.0V ILOAD = 0.1 mA +90C
+90C
VIN = 6V VOUT = 5.0V
0C +25C
-45C
0C -45C
10
12
14
16
18
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-9: Voltage.
Output Voltage vs. Input
FIGURE 2-12: Current.
Output Voltage vs. Load
DS22049D-page 6
(c) 2009 Microchip Technology Inc.
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 25 50
VOUT = 2.5V +130C +90C +25C +0C -45C
Dropout Voltage (V)
75 100 125 150 175 200 225 250 Load Current (mA)
FIGURE 2-13: Current.
0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0
Dropout Voltage vs. Load
FIGURE 2-16:
Dynamic Line Response.
Short Circuit Current (mA)
VOUT = 5.0V +130C +90C +25C
900 800 700 600 500 400 300 200 100 0 2 4 6 8 10 12
Dropout Voltage (V)
VOUT = 2.5V ROUT < 0.1?
+0C -45C
25
50
75 100 125 150 175 200 225 250 Load Current (mA)
14
16
18
Input Voltage (V)
FIGURE 2-14: Current.
Dropout Voltage vs. Load
FIGURE 2-17: Input Voltage.
1.00 Load Regulation (%) 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 -45 -20
VIN = 3.8V
Short Circuit Current vs.
VIN = 6V VIN = 12V
VOUT = 1.2V IOUT = 1 mA to 200 mA
VIN = 16V VIN = 3.2V
VIN = 14V
5
30
55
80
105
130
Temperature (C)
FIGURE 2-15:
Dynamic Line Response.
FIGURE 2-18: Temperature.
Load Regulation vs.
(c) 2009 Microchip Technology Inc.
DS22049D-page 7
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.20 Load Regulation (%) 1.00 0.80 0.60 0.40 0.20 0.00 -0.20 -0.40 -45 -20 5 30 55 80 Temperature (C)
VIN = 3.5V VIN = 12V VIN = 14V VIN = 16V
Line Regulation (%/V)
VOUT = 2.5V IOUT = 1 mA to 250 mA
0.20 0.16 0.12 0.08
100 mA
VOUT = 2.5V VIN = 3.5V to 16V 200 mA 250 mA
VIN = 6V
0.04 0.00
0 mA
105
130
-45
-20
5
30
55
80
105
130
Temperature (C)
FIGURE 2-19: Temperature.
1.00 Load Regulation (%) 0.80 0.60 0.40 0.20 0.00 -0.20 -0.40 -45 -20
VIN = 8V VIN = 16V
Load Regulation vs.
FIGURE 2-22: Temperature.
0.18 Line Regulation (%/V) 0.16 0.14 0.12 0.10 0.08 0.06 -45 -20 5
0 mA 200mA
Line Regulation vs.
VOUT = 5.0V IOUT = 1 to 250 mA VIN = 6V VIN = 12V
VOUT = 5.0V VIN = 6.0V to 16.0V
250 mA
100 mA
VIN = 14V
5
30
55
80
105
130
30
55
80
105
130
Temperature (C)
Temperature (C)
FIGURE 2-20: Temperature.
0.16 Line Regulation (%/V) 0.14 0.12
200 mA
Load Regulation vs.
FIGURE 2-23: Temperature.
Line Regulation vs.
VIN = 3.0 to 16.0V VOUT = 1.2V
0 -10 -20
1 mA
PSRR (dB)
0.10 0.08 0.06 0.04 0.02 0.00
-30 -40 -50 -60 -70 -80 -90 0.01
VR=1.2V VIN=2.7V VINAC = 100 mV p-p CIN=0 F IOUT=100 A
0 mA 100 mA
-45
-20
5
30
55
80
105
130
0.1
Temperature (C)
1 10 Frequency (kHz)
100
1000
FIGURE 2-21: Temperature.
Line Regulation vs.
FIGURE 2-24:
PSRR vs. Frequency.
DS22049D-page 8
(c) 2009 Microchip Technology Inc.
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
0 -10 -20 PSRR (dB) -30 -40 -50 -60 -70 -80 -90 0.01 0.1
VR=5.0V VIN=6.0V VINAC = 100 mV p-p CIN=0 F IOUT=100 A
1 10 Frequency (KHz)
100
1000
FIGURE 2-25:
PSRR vs. Frequency.
FIGURE 2-28:
Dynamic Load Response.
100
VR=5.0V, VIN=6.0V
IOUT=50 mA
Noise (V/ Hz)
10 1 0.1 0.01 0.001 0.01
VR=2.8V, VIN=3.8V
VR=1.2V, VIN=2.7V
0.1
1 10 Frequency (kHz)
100
1000
FIGURE 2-26:
Output Noise vs. Frequency.
FIGURE 2-29:
Dynamic Load Response.
FIGURE 2-27:
Power Up Timing.
(c) 2009 Microchip Technology Inc.
DS22049D-page 9
MCP1703
NOTES:
DS22049D-page 10
(c) 2009 Microchip Technology Inc.
MCP1703
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 2x3 DFN-8 4 1 8 2, 3, 5, 6, 7 9
MCP1703 PIN FUNCTION TABLE
Pin No. SOT-223-3 2,Tab 3 1 -- -- Pin No. SOT-23A 1 2 3 -- -- Pin No. SOT-89-3 1 3 2,Tab -- -- Name GND VOUT VIN NC EP Ground Terminal Regulated Voltage Output Unregulated Supply Voltage No Connection Exposed Thermal Pad (EP); must be connected to VSS. Function
3.1
Ground Terminal (GND)
3.3
Unregulated Input Voltage (VIN)
Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2.0 A typical) flows out of this pin; there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load.
3.2
Regulated Output Voltage (VOUT)
Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close to the LDO VOUT pin as is practical. The current flowing out of this pin is equal to the DC load current.
Connect VIN to the input unregulated source voltage. Like all low dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. For most applications, 1 F of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum, or aluminum electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at high-frequency.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB).
(c) 2009 Microchip Technology Inc.
DS22049D-page 11
MCP1703
NOTES:
DS22049D-page 12
(c) 2009 Microchip Technology Inc.
MCP1703
4.0
4.1
DETAILED DESCRIPTION
Output Regulation 4.3 Overtemperature
A portion of the LDO output voltage is fed back to the internal error amplifier and compared with the precision internal band-gap reference. The error amplifier output will adjust the amount of current that flows through the P-Channel pass transistor, thus regulating the output voltage to the desired value. Any changes in input voltage or output current will cause the error amplifier to respond and adjust the output voltage to the target voltage (refer to Figure 4-1).
4.2
Overcurrent
The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 150C. At that point, the LDO will shut down and begin to cool to the typical turn-on junction temperature of 130C. If the power dissipation is low enough, the device will continue to cool and operate normally. If the power dissipation remains high, the thermal shutdown protection circuitry will again turn off the LDO, protecting it from catastrophic failure.
The MCP1703 internal circuitry monitors the amount of current flowing through the P-Channel pass transistor. In the event of a short-circuit or excessive output current, the MCP1703 will turn off the P-Channel device for a short period, after which the LDO will attempt to restart. If the excessive current remains, the cycle will repeat itself.
MCP1703
VIN VOUT
Error Amplifier +VIN Voltage Reference +
Overcurrent Overtemperature
GND
FIGURE 4-1:
Block Diagram.
(c) 2009 Microchip Technology Inc.
DS22049D-page 13
MCP1703
NOTES:
DS22049D-page 14
(c) 2009 Microchip Technology Inc.
MCP1703
5.0 FUNCTIONAL DESCRIPTION
5.2 Output
The MCP1703 CMOS low dropout linear regulator is intended for applications that need the lowest current consumption while maintaining output voltage regulation. The operating continuous load range of the MCP1703 is from 0 mA to 250 mA (VR 2.5V). The input operating voltage range is from 2.7V to 16.0V, making it capable of operating from two or more alkaline cells or single and multiple Li-Ion cell batteries. The maximum rated continuous output current for the MCP1703 is 250 mA (VR 2.5V). For applications where VR < 2.5V, the maximum output current is 200 mA. A minimum output capacitance of 1.0 F is required for small signal stability in applications that have up to 250 mA output current capability. The capacitor type can be ceramic, tantalum, or aluminum electrolytic. The esr range on the output capacitor can range from 0 to 2.0. The output capacitor range for ceramic capacitors is 1 F to 22 F. Higher output capacitance values may be used for tantalum and electrolytic capacitors. Higher output capacitor values pull the pole of the LDO transfer function inward that results in higher phase shifts which in turn cause a lower crossover frequency. The circuit designer should verify the stability by applying line step and load step testing to their system when using capacitance values greater than 22 F.
5.1
Input
The input of the MCP1703 is connected to the source of the P-Channel PMOS pass transistor. As with all LDO circuits, a relatively low source impedance (10) is needed to prevent the input impedance from causing the LDO to become unstable. The size and type of the capacitor needed depends heavily on the input source type (battery, power supply) and the output current range of the application. For most applications (up to 100 mA), a 1 F ceramic capacitor will be sufficient to ensure circuit stability. Larger values can be used to improve circuit AC performance.
5.3
Output Rise time
When powering up the internal reference output, the typical output rise time of 1000 s is controlled to prevent overshoot of the output voltage.
(c) 2009 Microchip Technology Inc.
DS22049D-page 15
MCP1703
NOTES:
DS22049D-page 16
(c) 2009 Microchip Technology Inc.
MCP1703
6.0
6.1
APPLICATION CIRCUITS & ISSUES
Typical Application
EQUATION 6-2:
T J ( MAX ) = P TOTAL x R JA + T AMAX Where: TJ(MAX) PTOTAL RJA TAMAX = = = = Maximum continuous junction temperature Total device power dissipation Thermal resistance from junction-to-ambient Maximum ambient temperature
The MCP1703 is most commonly used as a voltage regulator. Its low quiescent current and low dropout voltage make it ideal for many battery-powered applications. MCP1703 VOUT 1.8V IOUT 50 mA GND VIN VOUT COUT 1 F Ceramic VIN 2.7V to 4.8V CIN 1 F Ceramic
The maximum power dissipation capability for a package can be calculated given the junction-toambient thermal resistance and the maximum ambient temperature for the application. The following equation can be used to determine the package maximum internal power dissipation.
FIGURE 6-1: 6.1.1
Typical Application Circuit.
EQUATION 6-3:
( T J ( MAX ) - T A ( MAX ) ) P D ( MAX ) = --------------------------------------------------R JA Where: PD(MAX) TJ(MAX) TA(MAX) RJA = = = = Maximum device power dissipation Maximum continuous junction temperature Maximum ambient temperature Thermal resistance from junction-to-ambient
APPLICATION INPUT CONDITIONS
Package Type = SOT-23A
Input Voltage Range = 2.7V to 4.8V VIN maximum = 4.8V VOUT typical = 1.8V IOUT = 50 mA maximum
6.2
6.2.1
Power Calculations
POWER DISSIPATION
The internal power dissipation of the MCP1703 is a function of input voltage, output voltage and output current. The power dissipation, as a result of the quiescent current draw, is so low, it is insignificant (2.0 A x VIN). The following equation can be used to calculate the internal power dissipation of the LDO.
EQUATION 6-4:
T J ( RISE ) = P D ( MAX ) x R JA Where: TJ(RISE) = = = Rise in device junction temperature over the ambient temperature Maximum device power dissipation Thermal resistance from junction to ambient
EQUATION 6-1:
P LDO = ( V IN ( MAX ) ) - V OUT ( MIN ) ) x I OUT ( MAX ) ) Where: PLDO VIN(MAX) VOUT(MIN) = = = LDO Pass device internal power dissipation Maximum input voltage LDO minimum output voltage Where: The maximum continuous operating junction temperature specified for the MCP1703 is +125C. To estimate the internal junction temperature of the MCP1703, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (RJA). The thermal resistance from junction to ambient for the SOT-23A pin package is estimated at 336C/W. TJ TJ(RISE) TA = = = PTOTAL RJA
EQUATION 6-5:
T J = T J ( RISE ) + T A Junction Temperature Rise in device junction temperature over the ambient temperature Ambient temperature
(c) 2009 Microchip Technology Inc.
DS22049D-page 17
MCP1703
6.3 Voltage Regulator
Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation are calculated in the following example. The power dissipation, as a result of ground current, is small enough to be neglected. TJ = TJRISE + TA(MAX) TJ = 91.3C Maximum Package Power Dissipation at +40C Ambient Temperature SOT-23A (336.0C/Watt = RJA) PD(MAX) = (+125C - 40C) / 336C/W PD(MAX) = 253 milli-Watts SOT-89 (75C/Watt = RJA) PD(MAX) = (+125C - 40C) / 75C/W PD(MAX) = 1.133 Watts SOT-223 (62.9C/Watt = RJA) PD(MAX) = (+125C - 40C) / 62.9C/W PD(MAX) = 1.35 Watts
6.3.1
Package
POWER DISSIPATION EXAMPLE
Package Type: SOT-23A Input Voltage: VIN = 2.7V to 4.8V LDO Output Voltages and Currents VOUT = 1.8V IOUT = 50 mA Maximum Ambient Temperature TA(MAX) = +40C Internal Power Dissipation Internal Power dissipation is the product of the LDO output current times the voltage across the LDO (VIN to VOUT). PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX) PLDO = (4.8V - (0.97 x 1.8V)) x 50 mA PLDO = 152.7 milli-Watts
6.4
Voltage Reference
Device Junction Temperature Rise
The internal junction temperature rise is a function of internal power dissipation and the thermal resistance from junction to ambient for the application. The thermal resistance from junction to ambient (RJA) is derived from an EIA/JEDEC standard for measuring thermal resistance for small surface mount packages. The EIA/JEDEC specification is JESD51-7, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages". The standard describes the test method and board specifications for measuring the thermal resistance from junction to ambient. The actual thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, "A Method to Determine How Much Power a SOT23 Can Dissipate in an Application", (DS00792), for more information regarding this subject. TJ(RISE) = PTOTAL x RqJA TJRISE = 152.7 milli-Watts x 336.0C/Watt TJRISE = 51.3C
The MCP1703 can be used not only as a regulator, but also as a low quiescent current voltage reference. In many microcontroller applications, the initial accuracy of the reference can be calibrated using production test equipment or by using a ratio measurement. When the initial accuracy is calibrated, the thermal stability and line regulation tolerance are the only errors introduced by the MCP1703 LDO. The low-cost, low quiescent current and small ceramic output capacitor are all advantages when using the MCP1703 as a voltage reference.
Ratio Metric Reference 2 A Bias CIN 1 F MCP1703 VIN VOUT GND PIC(R) Microcontroller COUT 1 F VREF ADO AD1 Bridge Sensor
FIGURE 6-2: Using the MCP1703 as a Voltage Reference.
6.5
Pulsed Load Applications
Junction Temperature Estimate
To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below.
For some applications, there are pulsed load current events that may exceed the specified 250 mA maximum specification of the MCP1703. The internal current limit of the MCP1703 will prevent high peak load demands from causing non-recoverable damage. The 250 mA rating is a maximum average continuous rating. As long as the average current does not exceed 250 mA, pulsed higher load currents can be applied to the MCP1703. The typical current limit for the MCP1703 is 500 mA (TA +25C).
(c) 2009 Microchip Technology Inc.
DS22049D-page 18
MCP1703
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Example: Standard Options for SOT-23A and SOT-89 Extended Temp
3-Pin SOT-23A
XXNN
Symbol
Voltage *
Symbol
Voltage *
HWNN
Example:
3-Lead SOT-89
XXXYYWW NNN
HM 1.2 HT 3.0 HP 1.5 HU 3.3 HQ 1.8 HV 4.0 HR 2.5 HW 5.0 HS 2.8 -- -- * Custom output voltages available upon request. Contact your local Microchip sales office for more information. Standard Options for SOT-223 Extended Temp Symbol Voltage * Symbol Voltage *
HM0934
256
3-Lead SOT-223 Tab is GND XXXXXXX XXXYYWW NNN
1 2 3
12 1.2 30 3.0 15 1.5 33 3.3 18 1.8 40 4.0 25 2.5 50 5.0 28 2.8 -- -- * Custom output voltages available upon request. Contact your local Microchip sales office for more information. Standard Options for 8-Lead DFN (2 x 3)
Example: Tab is GND MCP1703 15E0934 256
8-Lead DFN (2 x 3) Symbol XXX YWW NN
Extended Temp Voltage * Symbol Voltage *
Example:
AAU 1.2 AAY 3.3 AAV 1.8 AFR 4.0 AAW 2.5 AAZ 5.0 AAT 3.0 -- -- * Custom output voltages available upon request. Contact your local Microchip sales office for more information. Legend: XX...X Y YY WW NNN
AAU 934 25
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2009 Microchip Technology Inc.
DS22049D-page 19
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(c) 2009 Microchip Technology Inc.
DS22049D-page 25
MCP1703
NOTES:
DS22049D-page 26
(c) 2009 Microchip Technology Inc.
MCP1703
APPENDIX A: REVISION HISTORY
Revision D (September 2009)
The following is the list of modifications: 1. 2. 3. 4. 5. 6. Added the 8-Lead 2x3 DFN package. Updated the Temperature Specification table. Updated Table 3-1. Added Section 3.4 "Exposed Thermal Pad (EP)". Updated the Package Outline Drawings and the information for the 8-Lead 2x3 DFN package. Added the information for the 8-Lead 2x3 DFN package in the Product Identification System section.
Revision C (June 2009)
The following is the list of modifications: 1. 2. 3. 4. Absolute Maximum Ratings: Updated this section. DC Characteristics table: Updated. Temperature Specifications table: Updated. Package Information: Update Package Outline Drawings.
Revision B (February 2008)
The following is the list of modifications: 1. 2. 3. 4. Updated Temperature Specifications table. Updated Table 3-1. Updated Section 5.2 "Output". Added SOT-223 Landing Patterm Outline drawing.
Revision A (June 2007)
* Original Release of this Document.
(c) 2009 Microchip Technology Inc.
DS22049D-page 27
MCP1703
NOTES:
DS22049D-page 28
(c) 2009 Microchip Technology Inc.
MCP1703
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X X X/ XX Examples:
a) b) c) Device: MCP1703: 250 mA, 16V Low Quiescent Current LDO d) e) f) Output Voltage *: 12 = 1.2V "Standard" 15 = 1.5V "Standard" 18 = 1.8V "Standard" 25 = 2.5V "Standard" 28 = 2.8V "Standard" 30 = 3.0V "Standard" 33 = 3.3V "Standard" 40 = 4.0V "Standard" 50 = 5.0V "Standard" *Contact factory for other output voltage options. g) h) i) j) MCP1703T-1202E/XX: 1.2V Low Quiescent LDO, Tape and Reel MCP1703T-1502E/XX: 1.5V Low Quiescent LDO, Tape and Reel MCP1703T-1802E/XX: 1.8V Low Quiescent LDO, Tape and Reel MCP1703T-2502E/XX: 2.5V Low Quiescent LDO, Tape and Reel MCP1703T-2802E/XX: 2.8V Low Quiescent LDO, Tape and Reel MCP1703T-3002E/XX: 3.0V Low Quiescent LDO, Tape and Reel MCP1703T-3302E/XX: 3.3V Low Quiescent LDO, Tape and Reel MCP1703T-3602E/XX: 3.6V Low Quiescent LDO, Tape and Reel MCP1703T-4002E/XX: 4.0V Low Quiescent LDO, Tape and Reel MCP1703T-5002E/XX: 5.0V Low Quiescent LDO, Tape and Reel
Tape Output Feature Tolerance Temp. Package and Reel Voltage Code
Tape and Reel:
T
= Tape and Reel
Extra Feature Code:
0
= Fixed
Tolerance:
2
= 2.0% (Standard)
XX = = = =
CB for 3LD SOT-23A package DB for 3LD SOT-223 package MB for 3LD SOT-89 package MC for 8LD DFN package.
Temperature:
E
= -40C to +125C
Package Type:
CB DB MB MC
= = = =
Plastic Small Outline Transistor (SOT-23A) 3-lead, Plastic Small Outline Transistor (SOT-223) 3-lead, Plastic Small Outline Transistor (SOT-89) 3-lead. Plastic Dual Flat, No Lead Package (DFN) 2x3, 8-lead.
(c) 2009 Microchip Technology Inc.
DS22049D-page 29
MCP1703
NOTES:
DS22049D-page 30
(c) 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2009 Microchip Technology Inc.
DS22049D-page 31
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
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EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
DS22049D-page 32
(c) 2009 Microchip Technology Inc.

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